The advantages of laser
Diverse Solutions
The soldering head, which is the core of the system, is common to both the Firefly NEXT>Series B60 and T60 NEXT>Series machine configurations. The two solutions are characterized mainly by the side of the board where processing is performed: the BOTTOM solution, where the soldering process is carried out from below the PCB, and a TOP solution, where the soldering process is carried out from above the printed circuit board. This configuration is particularly suitable for automated processes where the system is integrated into an existing conveyor line.
The Firefly NEXT>Series soldering systems can be successfully integrated into high-volume production lines, as well as in those cases where the products to be soldered are continuously changing and Lead” and “Lead-free processes are often mixed.
Process traceability
Process traceability is ensured by the possibility to collect the video recording and thermal profiles acquired for every solder joint, and to associate them to the serial number of the printed circuit board. The collection of this data is also valuable as a debug tool of the soldering process.
Environment-friendly
With a maximum power absorption of 2.5 KW/h, the Fireflyfly NEXT>Series is easy to manage and maintain. In addition, the utilization of flux-based soldering alloys eliminates the need to use external fluxing stations, as well as the necessity for nitrogen. The consumption of solder alloy is limited to the amount applied to each joint, generating zero waste and eliminating disposal costs.
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