Haverhill, MA., August 2018 – Clients and interested parties are invited to join Seica Inc. for a Technology Day at their new location in Haverhill, MA. They will see everything from component level testing and equipment from MEMs, devices, such as pressure, and gas sensors, to microphones. High power and mix-signal ATE equipment will be present for demonstration. On display will be the Pilot V8 system and the Firefly laser selective soldering equipment. Bed of nail testers, such as the Compact system will be shown too, performing ICT and functional testing.
When: Wednesday, September 19, 2018 – 9:30am-5:00pm
Where: Seica Inc., 110 Avco Road Haverhill, MA 01835
Please RVSP no later than September 10, 2018
Pilot V8 Next > series, the most complete flying probe test platform on the market, provides up to 20 mobile resources for testing an electronic board, including test probes which can each apply up to 2A current, high-resolution cameras for automatic optical inspection, barcode and data matrix reading, laser sensors, capacitive probes, pyrometers, optical fiber sensors for LEDs, minifixtures for boundar -scan and On Board Programming, high-frequency probes able to measure signals at frequencies over 1.5 GHz (an absolutely unique performance on the market). Engineered for medium/high volume production, the Pilot V8 Next > series is available in a fully-automated version, capable of hosting from 1 to 12 racks of boards to be tested (even of different types) or for direct connection to board loading/unloading and tilt modules, compatible with any standard assembly line. The Pilot V8 Next > can be configured to satisfy the full range of different board test requirements: the HR version extends the performance to include probing of extremely miniaturized devices (down to 30 µm), while in the XL version expands the standard work area of 610 x 540 mm to 800 x 650 mm, able to accommodate and test “extra-large” boards
The Firefly Next > series, represents a major technological advance in laser selective soldering. The result of a totally new design and engineering effort, it includes a state-of-the art high-efficiency LASER source, a new spot angle on the board to be soldered, a fully-programmable donut spot and the perfect integration on a single axis of the laser, vision system and temperature sensor, which enables simple calibration and provides continuous, closed loop feedback from the soldering process, which greatly surpasses the levels of performance available until now in terms of throughput, applicability and reliability.